Thermal Contact Conductance (Mechanical Engineering Series) - copertina rigida, flessible

EAN (ISBN-13): 9780387945347
ISBN (ISBN-10): 0387945342
Copertina rigida
Anno di pubblicazione: 1996
Editore: Springer
188 Pagine
Peso: 0,450 kg
Lingua: eng/Englisch

Libro nella banca dati dal 2007-04-24T20:53:43+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2022-06-04T12:35:49+02:00 (Zurich)
ISBN/EAN: 0387945342

ISBN - Stili di scrittura alternativi:
0-387-94534-2, 978-0-387-94534-7
Stili di scrittura alternativi e concetti di ricerca simili:
Titolo del libro: telos, contact

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Dati dell'editore

Autore: C.V. Madhusudana
Titolo: Mechanical Engineering Series; Thermal Contact Conductance
Editore: Springer; Springer US
168 Pagine
Anno di pubblicazione: 1995-12-15
New York; NY; US
Peso: 0,970 kg
Lingua: Inglese
91,97 € (DE)
94,55 € (AT)
132,63 CHF (CH)
Not available, publisher indicates OP

BB; Book; Hardcover, Softcover / Physik, Astronomie/Thermodynamik; Thermodynamik und Wärme; Verstehen; metals; material; mechanism; design; plasticity; flow; heat transfer; C; Thermodynamics; Engineering; BB; BC; EA

1 Introduction.- 1.1 Mechanism of Contact Heat Transfer.- 1.2 Significance of Contact Heat Transfer.- 1.3 Scope of Present Work.- References.- 2 Thermal Constriction Resistance.- 2.1 Circular Disc in Half Space.- 2.2 Resistance of a Constriction Bounded by a Semi-Infinite Cylinder.- 2.3 Constriction in a Fluid Environment.- 2.4 Other Types of Constrictions.- References.- 3 Solid Spot Thermal Conductance of a Joint.- 3.1 Multiple Spot Contact Conductance.- 3.2 Estimation of the Number and Average Size of Contact Spots.- 3.2.1 Gaussian Distribution of Heights and Slopes.- 3.3 Deformation Analysis.- 3.3.1 The Plasticity Index.- 3.3.2 Ratio of Real to Apparent Area of Contact.- 3.4 Theoretical Expressions for Thermal Contact Conductance.- 3.4.1 Solid Spot Conductance for Fully Plastic Deformation.- 3.4.2 Solid Spot Conductance for Elastic Deformation.- 3.5 Effect of Macroscopic Irregularities.- 3.6 Correlations for Solid Spot Conductance.- 3.7 Numerical Example: Solid Spot Conductance.- References.- 4 Gas Gap Conductance.- 4.1 Factors Affecting Gas Gap Conductance.- 4.2 The Accommodation Coefficient.- 4.2.1 Effect of Temperature on Accommodation Coefficient.- 4.2.2 Summary of Observations.- 4.3 Effect of Gas Pressure on Gas Gap Conductance.- 4.4 Correlations for Gas Gap Conductance.- 4.5 Gas Gap Conductance: Conclusions.- 4.6 Numerical Example: Gas Gap Conductance.- References.- 5 Experimental Aspects.- 5.1 Axial Heat Flow Apparatus.- 5.2 Radial Heat Flow Apparatus.- 5.3 Periodic Contacts.- 5.4 Transient Measurements.- 5.5 Analog Methods.- 5.6 Accuracy.- 5.7 Summary.- References.- 6 Control of Thermal Contact Conductance Using Interstitial Materials.- 6.1 Solid Interstitial Materials.- 6.2 Metallic Foils.- 6.3 Wire Screens.- 6.4 Surface Coatings.- 6.4.1 Constriction Resistance in a Plated Contact.- 6.4.2 Thermal Contact Conductance of Coated Surfaces.- 6.5 Insulating Interstitial Materials.- 6.6 Lubricating Films and Greases.- 6.7 Other Interstitial Materials.- References.- 7 Special Topics in Thermal Contact Conductance.- 7.1 Bolted or Riveted Joints.- 7.1.1 Stress Distribution at the Bolted Joint Interface.- 7.1.2 Heat Transfer in Bolted Joints.- 7.1.3 Summary.- 7.2 Cylindrical Joints.- 7.3 Rectification.- 7.3.1 Rectification at Moderate to High Contact Pressures.- 7.3.2 Specimens with Spherical Caps.- 7.3.3 Plane Ended Specimens.- 7.3.4 Microscopic Resistance.- 7.3.5 Rectification at Low Contact Pressures.- 7.3.6 Summary.- 7.4 Hysteresis.- 7.5 Effective Thermal Conductivity of Packed Beds.- 7.6 Stacks of Laminations.- 7.7 Solid Spot Conductance of Specific Materials.- 7.7.1 Stainless Steel and Aluminum.- 7.7.2 Zircaloy-2/Uranium Dioxide Interfaces.- 7.7.3 Porous Materials.- 7.8 Thermal Contact Resistance in the Presence of Oxide Films.- References.- 8 Concluding Remarks.- 8.1 Control of Thermal Contact Conductance.- 8.1.1 Bare Metallic Junctions.- 8.1.2 Use of Interstitial Materials.- 8.1.3 Load Cycling.- 8.1.4 Heat Flow Direction.- 8.1.5 Stacks of Laminations.- 8.2 Recommendations for Further Research.- References.- Author Index.