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2010, ISBN: 9780470823774
From Algorithm to Chip, Buch, Hardcover, The first book to explain the principals behind mobile 3D hardware implementation, helping readers understand advanced algorithms, produce low-cos… Altro …
Yoo, Hoi-Jun, Woo, Jeong-Ho, Sohn, Ju-Ho, Nam, Byeong-Gyu:
Mobile 3D Graphics SoC: From Algorithm to Chip (IEEE Press) - Prima edizione2010, ISBN: 9780470823774
edizione con copertina rigida
Wiley-IEEE Press, Hardcover, Auflage: 1, 352 Seiten, Publiziert: 2010-06-11T00:00:01Z, Produktgruppe: Book, 0.74 kg, Books Global Store, Special Features, Books, 3-D Graphics, Graphics & … Altro …
2010
ISBN: 9780470823774
Hardcover, All pages and cover are intact. Possible slightly loose binding, minor highlighting and marginalia, cocked spine or torn dust jacket. Maybe an ex-library copy and not include t… Altro …
2006, ISBN: 9780470823774
Hardcover, PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from… Altro …
2010, ISBN: 0470823771
[EAN: 9780470823774], Nouveau livre, [SC: 66.93], [PU: Wiley-IEEE Press], Books
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Informazioni dettagliate del libro - Mobile 3D Graphics SoC
EAN (ISBN-13): 9780470823774
ISBN (ISBN-10): 0470823771
Copertina rigida
Anno di pubblicazione: 2010
Editore: Wiley-IEEE Press
344 Pagine
Peso: 0,749 kg
Lingua: eng/Englisch
Libro nella banca dati dal 2008-06-02T18:43:07+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-07-21T18:24:39+02:00 (Zurich)
ISBN/EAN: 0470823771
ISBN - Stili di scrittura alternativi:
0-470-82377-1, 978-0-470-82377-4
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : jun, jeong, sohn, söhn, nam, general hoi
Titolo del libro: graphics graphic, mobile
Dati dell'editore
Autore: Jeong-Ho Woo; Ju-Ho Sohn; Byeong-Gyu Nam; Hoi-Jun Yoo
Titolo: Mobile 3D Graphics SoC - From Algorithm to Chip
Editore: John Wiley & Sons
344 Pagine
Anno di pubblicazione: 2010-06-11
Peso: 1,000 kg
Lingua: Inglese
139,00 € (DE)
No longer receiving updates
168mm x 244mm x 23mm
BB; GB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Computergraphik; Electrical & Electronics Engineering; Schaltkreise - Theorie u. Entwurf / VLSI / ULSI; Computer Science; Informatik; Visualisierung u. Computergraphik; Circuit Theory & Design / VLSI / ULSI; Drahtlose Kommunikation; Elektrotechnik u. Elektronik; Visualization & Computer Graphics; Mobile & Wireless Communications; Schaltkreistechnik
Preface. 1 Introduction. 1.1 Mobile 3D Graphics. 1.2 Mobile Devices and Design Challenges. 1.2.1 Mobile Computing Power. 1.2.2 Mobile Display Devices. 1.2.3 Design Challenges. 1.3 Introduction to SoC Design. 1.4 About this Book. 2 Application Platform. 2.1 SoC Design Paradigms. 2.1.1 Platform and Set-based Design. 2.1.2 Modeling: Memory and Operations. 2.2 System Architecture. 2.2.1 Reference Machine and API. 2.2.2 Communication Architecture Design. 2.2.3 System Analysis. 2.3 Low-power SoC Design. 2.3.1 CMOS Circuit-level Low-power Design. 2.3.2 Architecture-level Low-power Design. 2.3.3 System-level Low-power Design. 2.4 Network-on-Chip based SoC. 2.4.1 Network-on-Chip Basics. 2.4.2 NoC Design Considerations. 2.4.3 Case Studies of Chip Implementation. 3 Introduction to 3D Graphics. 3.1 The 3D Graphics Pipeline. 3.1.1 The Application Stage. 3.1.2 The Geometry Stage. 3.1.3 The Rendering Stage. 3.2 Programmable 3D Graphics. 3.2.1 Programmable Graphics Pipeline. 3.2.2 Shader Models. 4 Mobile 3D Graphics. 4.1 Principles of Mobile 3D Graphics. 4.1.1 Application Challenges. 4.1.2 Design Principles. 4.2 Mobile 3D Graphics APIs. 4.2.1 KAIST MobileGL. 4.2.2 Khronos OpenGL-ES. 4.2.3 Microsoft's Direct3D-Mobile. 4.3 Summary and Future Directions. 5 Mobile 3D Graphics SoC. 5.1 Low-power Rendering Processor. 5.1.1 Early Depth Test. 5.1.2 Logarithmic Datapaths. 5.1.3 Low-power Texture Unit. 5.1.4 Tile-based Rendering. 5.1.5 Texture Compression. 5.1.6 Texture Filtering and Anti-aliasing. 5.2 Low-power Shader. 5.2.1 Vertex Cache. 5.2.2 Low-power Register File. 5.2.3 Mobile Unified Shader. 6 Real Chip Implementations. 6.1 KAIST RAMP Architecture. 6.1.1 RAMP-IV. 6.1.2 RAMP-V. 6.1.3 RAMP-VI. 6.1.4 RAMP-VII. 6.2 Industry Architecture. 6.2.1 nVidia Mobile GPU - SC10 and Tegra. 6.2.2 Sony PSP. 6.2.3 Imagination Technology MBX/SGX. 7 Low-power Rasterizer Design. 7.1 Target System Architecture. 7.2 Summary of Performance and Features. 7.3 Block Diagram of the Rasterizer. 7.4 Instruction Set Architecture (ISA). 7.5 Detailed Design with Register Transfer Level Code. 7.5.1 Rasterization Top Block. 7.5.2 Pipeline Architecture. 7.5.3 Main Controller Design. 7.5.4 Rasterization Core Unit. 8 The Future of Mobile 3D Graphics. 8.1 Game and Mapping Applications Involving Networking. 8.2 Moves Towards More User-centered Applications. 8.3 Final Remarks. Appendix Verilog HDL Design. A.1 Introduction to Verilog Design. A.2 Design Level. A.2.1 Behavior Level. A.2.2 Register Transfer Level. A.2.3 Gate Level. A.3 Design Flow. A.3.1 Specification. A.3.2 High-level Design. A.3.3 Low-level Design. A.3.4 RTL Coding. A.3.5 Simulation. A.3.6 Synthesis. A.3.7 Placement and Routing. A.4 Verilog Syntax. A.4.1 Modules. A.4.2 Logic Values and Numbers. A.4.3 Data Types. A.4.4 Operators. A.4.5 Assignment. A.4.6 Ports and Connections. A.4.7 Expressions. A.4.8 Instantiation. A.4.9 Miscellaneous. A.5 Example of Four-bit Adder with Zero Detection. A.6 Synthesis Scripts. Glossaries. Index.Altri libri che potrebbero essere simili a questo:
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