- 5 Risultati
prezzo più basso: € 106,88, prezzo più alto: € 144,58, prezzo medio: € 117,91
1
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - Tadashi Takakura
Ordina
da ZVAB.com
€ 109,42
Spedizione: € 0,001
OrdinaLink sponsorizzato
Tadashi Takakura:

Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - copertina rigida, flessible

1993, ISBN: 0792321049

[EAN: 9780792321040], Neubuch, [SC: 0.0], [PU: Springer Netherlands], METEOROLOGIE; WITTERUNG; ÖKOLOGIE / GEOGRAFIE, LANDSCHAFT, BODEN; PFLANZE PHYSIOLOGIE; PHYSIOLOGIE (PFLANZE); SYSTEMT… Altro …

NEW BOOK. Costi di spedizione:Versandkostenfrei. (EUR 0.00) AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)]
2
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Tadashi Takakura
Ordina
da buchfreund.de
€ 117,43
Spedizione: € 0,001
OrdinaLink sponsorizzato

Tadashi Takakura:

Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - copertina rigida, flessible

1993, ISBN: 9780792321040

Gebunden, 172 Seiten, 241mm x 160mm x 15mm, Sprache(n): eng From mulching to greenhouses, the air space between the cover and the soil surface is the key to the classification of climates… Altro …

Costi di spedizione:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES Buch- und Medienhandel, 14621 Schönwalde-Glien
3
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
Ordina
da Achtung-Buecher.de
€ 144,58
Spedizione: € 0,001
OrdinaLink sponsorizzato
Takakura, Tadashi:
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - copertina rigida, flessible

1993

ISBN: 0792321049

1993 Gebundene Ausgabe Meteorologie, Witterung, Ökologie / Geografie, Landschaft, Boden, Pflanze / Physiologie, Physiologie (Pflanze), Systemtheorie, Pflanzenbiologie, Meteorologie und … Altro …

Costi di spedizione:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien
4
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
Ordina
da Achtung-Buecher.de
€ 111,22
Spedizione: € 0,001
OrdinaLink sponsorizzato
Takakura, Tadashi:
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - copertina rigida, flessible

1993, ISBN: 0792321049

1993 Gebundene Ausgabe Meteorologie, Witterung, Ökologie / Geografie, Landschaft, Boden, Pflanze / Physiologie, Physiologie (Pflanze), Systemtheorie, Pflanzenbiologie, Meteorologie und … Altro …

Costi di spedizione:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien
5
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
Ordina
da Blackwells.co.uk
£ 93,54
(indicativi € 106,88)
Spedizione: € 7,431
OrdinaLink sponsorizzato
Takakura, Tadashi:
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - copertina rigida, flessible

ISBN: 9780792321040

hardback, [PU: Kluwer Academic Publishers]

in stock. Costi di spedizione:Unknown. (EUR 7.43) Blackwells.co.uk

1Poiché alcune piattaforme non trasmettono le condizioni di spedizione e queste possono dipendere dal paese di consegna, dal prezzo di acquisto, dal peso e dalle dimensioni dell'articolo, dall'eventuale iscrizione alla piattaforma, dalla consegna diretta da parte della piattaforma o tramite un fornitore terzo (Marketplace), ecc. è possibile che le spese di spedizione indicate da eurolibro non corrispondano a quelle della piattaforma offerente.

Dati bibliografici del miglior libro corrispondente

Dettagli del libro
Climate under Cover: Digital Dynamic Simulation in Plant Bio-Engineering

From mulching to greenhouses, the air space between the cover and the soil surface is the key to the classification of climates under cover. The same mechanism governs environments produced by the various covers. This book describes and analyses all the different environments from mulching to greenhouses. The relationship between plants and environment is another important topic in the book. Stress is placed on the link between quantitative phenomena and qualitative analyses. Most phenomena involved are nonlinear and non-steady-state. An approach called System Dynamics is used, and simulation models developed in the simulation language CSMP are fully used. The subjects covered are of relevance to graduate students, to scientists and researchers in agriculture and biological sciences and, of course, to agricultural organizations in both the developing and developed countries.

Informazioni dettagliate del libro - Climate under Cover: Digital Dynamic Simulation in Plant Bio-Engineering


EAN (ISBN-13): 9780792321040
ISBN (ISBN-10): 0792321049
Copertina rigida
Anno di pubblicazione: 1993
Editore: Springer-Verlag GmbH
150 Pagine
Peso: 0,426 kg
Lingua: eng/Englisch

Libro nella banca dati dal 2007-12-07T19:03:49+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-12-13T22:48:11+01:00 (Zurich)
ISBN/EAN: 0792321049

ISBN - Stili di scrittura alternativi:
0-7923-2104-9, 978-0-7923-2104-0
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : tadashi
Titolo del libro: climate under cover, agricultural engineer, bio, plant simulation, digital, climate engineering


Dati dell'editore

Autore: Tadashi Takakura
Titolo: Climate Under Cover - Digital Dynamic Simulation in Plant Bio-Engineering
Editore: Springer; Springer Netherland
155 Pagine
Anno di pubblicazione: 1993-01-31
Dordrecht; NL
Lingua: Inglese
106,99 € (DE)
109,99 € (AT)
118,00 CHF (CH)
Available
XII, 155 p.

BB; Hardcover, Softcover / Mathematik/Sonstiges; Kybernetik und Systemtheorie; Verstehen; Dynamics; System Dynamics; environment; simulation; soil; system; temperature; Systems Theory, Control; Atmospheric Science; Soil Science; Plant Physiology; Meteorologie und Klimatologie (Klimaforschung); Bodenkunde und Bodenmanagement; Pflanzenbiologie; BC; EA

1. Introduction.- 1.1 Introduction.- 1.2 Europe and North America.- 1.3 Asia.- 1.4 Japan.- Problems.- 2. Definition of Covering and Properties of Covering Materials.- 2.1 Introduction.- 2.2 Mulching.- 2.3 Row covers (Tunnels).- 2.4 Floating mulches (Floating row cover).- 2.5 Rain shelters.- 2.6 Unheated greenhouses.- 2.7 Covering materials.- Problems.- 3. Digital Simulation.- 3.1 Introduction.- 3.2 System dynamics.- 3.3 Simulation languages.- 3.4 Digital simulation by CSMP.- 3.5 Model structure and representation.- 3.6 A model for temperature regimes in the soil (CUC-01.- 3.7 Application to steady-state models.- Problems.- 4. Heat Balance of Bare Ground.- 4.1 Introduction.- 4.2 Convective heat transfer.- 4.3 A model with solar radiation and air temperature boundary condition (CUC-02).- 4.4 Mass transfer.- 4.5 A model with latent heat transfer (CUC-03).- 4.6 Radiation balance.- 4.7 Long-wave radiation.- Problems.- 5. Solar Radiation Environment.- 5.1 Introduction.- 5.2 Units of radiation and light.- 5.3 Solar radiation properties of covering materials.- 5.4 Calculation of transmissivity (CUC-04).- 5.5 Solar radiation.- 5.6 The sun’s altitude and azimuth.- Problems.- 6. Temperature Environment under Cover.- 6.1 Introduction.- 6.2 Effect of mulching.- 6.3 Temperature environment under row covers (CUC-30).- 6.4 Double layer greenhouse model (CUC-50).- 6.5 A pad and fan greenhouse model (CUC-35).- Problems.- 7. CO2 Environment.- 7.1 Introduction.- 7.2 CO2 concentration in soil layer (CUC-70).- 7.3 CO2 concentration in a plastic house and ventilation.- Problems.- 8. Water and Water Vapor Environment.- 8.1 Introduction.- 8.2 Water and water vapor movement in soil.- 8.3 Application to water and heat balance in soil layer (CUC-90).- 8.4 Interaction between water movement andheat flow.- Problems.- 9. Control Function.- 9.1 Introduction.- 9.2 System response.- 9.3 PID control.- 9.4 Temperature control logic (CUC-120).- 9.5 Feedback vs. feedforward control.- Problems.- 10. Plant Response to the Environment.- 10.1 Introduction.- 10.2 Plant photosynthesis and respiration.- 10.3 Energy balance of a plant leaf.- 10.4 Stomata resistance of plant (CUC-151).- 10.5 Plant growth model.- Problems.- References.

< Per archiviare...