1999, ISBN: 9780792361176
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[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Proceedings of the NATO Advanced Research Workshop, Kiev, Ukraine, 12-15 October 1998 This proceedings volume contains the con… Altro …
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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices - edizione con copertina flessibile
2008, ISBN: 9780792361176
Trade paperback, Trade paperback (US). Glued binding. 368 p. NATO Science Partnership Sub-Series: 3: , 73. Audience: General/trade., NEW BOOK(NEVER OPENED)/slightly shelf-aged cover-No in… Altro …
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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices (Nato Science Partnership Subseries: 3, 73) - edizione con copertina flessibile
1999, ISBN: 9780792361176
paperback, Access codes and supplements are not guaranteed with used items. May be an ex-library book., Gebraucht, guter Zustand, [PU: Springer]
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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices - edizione con copertina flessibile
2000, ISBN: 9780792361176
Springer, 2000. Paperback. Very Good. Former library book. Edition 2000. Ammareal gives back up to 15% of this book's net price to charity organizations., Springer, 2000, 3
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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices (Nato Science Partnership Subseries: 3) - edizione con copertina flessibile
ISBN: 9780792361176
Springer. Paperback. New. New. In shrink wrap. Looks like an interesting title!, Springer, 6
Biblio.co.uk |
1999, ISBN: 9780792361176
edizione con copertina flessibile
[ED: Kartoniert / Broschiert], [PU: Springer Netherlands], Proceedings of the NATO Advanced Research Workshop, Kiev, Ukraine, 12-15 October 1998 This proceedings volume contains the con… Altro …
Hemment, Peter L F (Editor), and Lysenko, Vladimir S (Editor), and Nazarov, Alexei N (Editor):
Perspectives, Science and Technologies for Novel Silicon on Insulator Devices - edizione con copertina flessibile2008, ISBN: 9780792361176
Trade paperback, Trade paperback (US). Glued binding. 368 p. NATO Science Partnership Sub-Series: 3: , 73. Audience: General/trade., NEW BOOK(NEVER OPENED)/slightly shelf-aged cover-No in… Altro …
Perspectives, Science and Technologies for Novel Silicon on Insulator Devices (Nato Science Partnership Subseries: 3, 73) - edizione con copertina flessibile
1999
ISBN: 9780792361176
paperback, Access codes and supplements are not guaranteed with used items. May be an ex-library book., Gebraucht, guter Zustand, [PU: Springer]
Perspectives, Science and Technologies for Novel Silicon on Insulator Devices - edizione con copertina flessibile
2000, ISBN: 9780792361176
Springer, 2000. Paperback. Very Good. Former library book. Edition 2000. Ammareal gives back up to 15% of this book's net price to charity organizations., Springer, 2000, 3
Perspectives, Science and Technologies for Novel Silicon on Insulator Devices (Nato Science Partnership Subseries: 3) - edizione con copertina flessibile
ISBN: 9780792361176
Springer. Paperback. New. New. In shrink wrap. Looks like an interesting title!, Springer, 6
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Informazioni dettagliate del libro - Perspectives Science and Technologies for Novel Silicon on Insulator Devices
EAN (ISBN-13): 9780792361176
ISBN (ISBN-10): 0792361172
Copertina flessibile
Anno di pubblicazione: 1999
Editore: Springer Netherlands
368 Pagine
Peso: 0,556 kg
Lingua: eng/Englisch
Libro nella banca dati dal 2007-04-06T04:57:28+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-07-15T18:13:24+02:00 (Zurich)
ISBN/EAN: 9780792361176
ISBN - Stili di scrittura alternativi:
0-7923-6117-2, 978-0-7923-6117-6
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : vladimir nazarov, lysenko, peter will
Titolo del libro: perspectives, silicon insulator technology, kyiv, devices wonder, science and technologie
Dati dell'editore
Autore: Peter L.F. Hemment; Vladimir S. Lysenko; Alexei N. Nazarov
Titolo: NATO Science Partnership Subseries: 3; Perspectives, Science and Technologies for Novel Silicon on Insulator Devices
Editore: Springer; Springer Netherland
344 Pagine
Anno di pubblicazione: 1999-12-31
Dordrecht; NL
Peso: 1,140 kg
Lingua: Inglese
53,49 € (DE)
54,99 € (AT)
59,00 CHF (CH)
POD
XXII, 344 p.
BC; Electronics and Microelectronics, Instrumentation; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; CMOS; Laser; Sensor; Transistor; development; electronics; field-effect transistor; metal oxide semiconductur field-effect transistor; microelectromechanical system (MEMS); modeling; simulation; static-induction transistor; thin film; thin film transistor; Optical and Electronic Materials; Solid State Physics; Spectroscopy and Microscopy; Electrical Engineering; Mechanical Engineering; Electronics and Microelectronics, Instrumentation; Optical Materials; Condensed Matter Physics; Spectroscopy; Electrical and Electronic Engineering; Mechanical Engineering; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Physik der kondensierten Materie (Flüssigkeits- und Festkörperphysik); Spektroskopie, Spektrochemie, Massenspektrometrie; Elektrotechnik; Maschinenbau; BB
Preface. Committee Members. Invited Speakers. Workshop Photographs. Section 1: Innovations in Materials Technologies. 1.1. SMART-CUT® Technology: Basic Mechanisms and Applications; M. Bruel. 1.2. Polish Stop Technology for Silicon on Silicide on Insulator Structures; H.S. Gamble. 1.3. Homoepitaxy on Porous Silicon with a Buries Oxide Layer; Full-Wafer Scale SOI; S.I. Romanov, et al. 1.4. Structural and Electrical Properties of Silicon on Isolator Structures Manufactured on FZ- and CZ-Silicon by SMART-CUT Technology; V.P. Popov, et al. 1.5. Development of Linear Sequential Lateral Solidification Technique to Fabricate Quasi-Single-Crystal Super-Thin Si Films for High-Performance Thin Film Transistor Devices; A.B. Limanov, et al. Section 2: Economics and Innovation Applications. 2.1. Low Temperature Polysilicon Technology: A Low Cost SOI Technology? F. Plais, et al. 2.2. A Novel Low Cost Process for the Production of Semiconductor Polycrystalline Silicon from Recycled Industrial Waste; B.N. Mukashev, et al. 2.3. Tetrahedrally Bonded Amorphous Carbon for Electronic Applications; W.I. Milne. 2.4. Diamond Based Silicon-on-Insulator Materials and Devices; S. Bengtsson, M. Bergh. 2.5. Low-Temperature Processing of Crystalline Si Films on Glass for Electronic Applications; R.B. Bergmann, et al. 2.6. beta-SiC on SiO2 Formed by Ion Implantation and Bonding for Micromechanics Applications; C. Serre, et al. 2.7. Laser Recrystallized Polysilicon Layers for Sensor Applications: Electrical Piezoresistive Characterization; A.A. Druzhinin, et al. Section 3: CharacterisationMethods for SOI. 3.1. Optical Spectroscopy of SOI Materials; A. Pérez-Rodríguez, et al. 3.2. Computer Simulation of Oxygen Redistribution in SOI Structures; V.G. Litovchenko, A.A. Efremov. 3.3. Electrical Instabilities in Silicon-on-Insulator Structures and Devices During Voltage and Temperature Stressing; A.N. Nazarov, et al. 3.4. Hydrogen as a Diagnostic Tool in Analysing SOI Structures; A. Boutry-Forveille, et al. 3.5. Back Gate Voltage Influence on the LDD SOI NMOSFET Series Resistance Extraction from 150 to 300 K; A.S. Nicolett, et al. 3.6. Characterization of Porous Silicon Layers Containing a Buried Oxide Layer; S.I. Romanov, et al. 3.7. Total-Dose Radiation Response of Multilayer Buried Insulators; A.N. Rudenko, et al. 3.8. Recombination Current in Fully-Depleted SOI Diodes: Compact Model and Lifetime Extraction; T. Ernst, et al. 3.9. Investigation of the Structural and Chemical Properties of SOI Materials by Ellipsometry; L.A. Zabashta, et al. 3.10. Experimental Investigation and Modeling of Coplanar Transmission Lines on SOI Technologies for RF Applications; J. Lescot, et al. Section 4: Perspectives for SOI Structures and Devices. 4.1. Perspectives of Silicon-on-Insulator Technologies for Cryogenic Electronics; C. Claeys, et al. 4.2. SOI CMOS for High-Temperature Applications; J.P. Colinge. 4.3. Quantum Effect Devices on SOI Substrates with an Ultrathin Silicon Layer; Y. Omura. 4.4. Wafer Bonding for Micro-ElectroMechanical Systems (MEMS); C.A. Colinge. 4.5. A ComProceedings of the NATO Advanced Research Workshop, Kiev, Ukraine, 12-15 October 1998
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