2010, ISBN: 9783642077388
Editor: Oliver, M.R. Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2004, 439 Seiten, Publiziert: 2010-12-01T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 298 blac… Altro …
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2010, ISBN: 9783642077388
Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… Altro …
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2010, ISBN: 9783642077388
Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… Altro …
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2010, ISBN: 3642077382
edizione con copertina rigida
Softcover reprint of hardcover 1st ed. 2004 Kartoniert / Broschiert Physikalische Chemie, Materialwissenschaft, Werkstoffprüfung, Fertigungstechnik und Ingenieurwesen, Elektronik, diele… Altro …
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ISBN: 9783642077388
Springer , pp. 442 . Papeback. New., Springer, 6
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Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69) - edizione con copertina flessibile
2010, ISBN: 9783642077388
Editor: Oliver, M.R. Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2004, 439 Seiten, Publiziert: 2010-12-01T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 298 blac… Altro …
2010, ISBN: 9783642077388
Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… Altro …
2010
ISBN: 9783642077388
Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… Altro …
2010, ISBN: 3642077382
edizione con copertina rigida
Softcover reprint of hardcover 1st ed. 2004 Kartoniert / Broschiert Physikalische Chemie, Materialwissenschaft, Werkstoffprüfung, Fertigungstechnik und Ingenieurwesen, Elektronik, diele… Altro …
ISBN: 9783642077388
Springer , pp. 442 . Papeback. New., Springer, 6
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Informazioni dettagliate del libro - Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)
EAN (ISBN-13): 9783642077388
ISBN (ISBN-10): 3642077382
Copertina rigida
Copertina flessibile
Anno di pubblicazione: 2010
Editore: Springer
Libro nella banca dati dal 2014-10-10T08:23:08+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-11-03T22:27:35+01:00 (Zurich)
ISBN/EAN: 9783642077388
ISBN - Stili di scrittura alternativi:
3-642-07738-2, 978-3-642-07738-8
Stili di scrittura alternativi e concetti di ricerca simili:
Titolo del libro: mechanical materials, mechanica
Dati dell'editore
Autore: M.R. Oliver
Titolo: Springer Series in Materials Science; Chemical-Mechanical Planarization of Semiconductor Materials
Editore: Springer; Springer Berlin
428 Pagine
Anno di pubblicazione: 2010-12-01
Berlin; Heidelberg; DE
Stampato / Fatto in
Lingua: Inglese
213,99 € (DE)
219,99 € (AT)
236,00 CHF (CH)
POD
XI, 428 p.
BC; Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik; Werkstoffprüfung; Verstehen; dielectrics; material; metals; reactions; semiconductor; semiconductor technology; Characterization and Analytical Technique; Electronics and Microelectronics, Instrumentation; Machines, Tools, Processes; Physical Chemistry; Surfaces, Interfaces and Thin Film; Optical Materials; Elektronik; Fertigungstechnik und Ingenieurwesen; Physikalische Chemie; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; BB; EA
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanisms Includes supplementary material: sn.pub/extras
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