2014, ISBN: 9783659624650
Kartoniert, 228 Seiten, 220mm x 150mm x 14mm, Sprache(n): eng This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature application… Altro …
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Flip chip assembly: Modelling the joints' high-temperature reliability - edizione con copertina flessibile
2014, ISBN: 3659624659
[EAN: 9783659624650], Neubuch, [PU: LAP LAMBERT Academic Publishing], nach der Bestellung gedruckt Neuware - Printed after ordering - This text intends to give insight into assembly of fl… Altro …
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Flip chip assembly: Modelling the joints' high-temperature reliability | Emeka Amalu | Taschenbuch | Paperback | 228 S. | Englisch | 2014 | LAP LAMBERT Academic Publishing | EAN 9783659624650 - edizione con copertina flessibile
2014, ISBN: 9783659624650
[ED: Taschenbuch], [PU: LAP LAMBERT Academic Publishing], This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature applications. I… Altro …
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2014, ISBN: 3659624659
Kartoniert / Broschiert, mit Schutzumschlag 11, [PU:LAP LAMBERT Academic Publishing]
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Flip chip assembly: Modelling the joints' high-temperature reliability - edizione con copertina flessibile
2014, ISBN: 3659624659
[EAN: 9783659624650], Neubuch, [PU: LAP Lambert Academic Publishing], Books
AbeBooks.de Lucky's Textbooks, Dallas, TX, U.S.A. [60577173] [Rating: 5 (von 5)] NEW BOOK. Costi di spedizione: EUR 68.69 Details... |
2014, ISBN: 9783659624650
Kartoniert, 228 Seiten, 220mm x 150mm x 14mm, Sprache(n): eng This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature application… Altro …
Emeka Amalu:
Flip chip assembly: Modelling the joints' high-temperature reliability - edizione con copertina flessibile2014, ISBN: 3659624659
[EAN: 9783659624650], Neubuch, [PU: LAP LAMBERT Academic Publishing], nach der Bestellung gedruckt Neuware - Printed after ordering - This text intends to give insight into assembly of fl… Altro …
Flip chip assembly: Modelling the joints' high-temperature reliability | Emeka Amalu | Taschenbuch | Paperback | 228 S. | Englisch | 2014 | LAP LAMBERT Academic Publishing | EAN 9783659624650 - edizione con copertina flessibile
2014
ISBN: 9783659624650
[ED: Taschenbuch], [PU: LAP LAMBERT Academic Publishing], This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature applications. I… Altro …
2014, ISBN: 3659624659
Kartoniert / Broschiert, mit Schutzumschlag 11, [PU:LAP LAMBERT Academic Publishing]
Flip chip assembly: Modelling the joints' high-temperature reliability - edizione con copertina flessibile
2014, ISBN: 3659624659
[EAN: 9783659624650], Neubuch, [PU: LAP Lambert Academic Publishing], Books
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Informazioni dettagliate del libro - Flip Chip Assembly
EAN (ISBN-13): 9783659624650
ISBN (ISBN-10): 3659624659
Copertina flessibile
Anno di pubblicazione: 2014
Editore: LAP Lambert Academic Publishing
Libro nella banca dati dal 2016-08-12T04:02:30+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-12-17T15:09:31+01:00 (Zurich)
ISBN/EAN: 9783659624650
ISBN - Stili di scrittura alternativi:
3-659-62465-9, 978-3-659-62465-0
Stili di scrittura alternativi e concetti di ricerca simili:
Titolo del libro: assembly, chip
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