ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
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2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Altro …
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ISBN: 9781441909831
Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … Altro …
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ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
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2009, ISBN: 1441909834
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ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Altro …
2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… Altro …
ISBN: 9781441909831
Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … Altro …
ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
2009, ISBN: 1441909834
[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books
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Informazioni dettagliate del libro - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Copertina rigida
Anno di pubblicazione: 2009
Editore: Springer
285 Pagine
Peso: 0,635 kg
Lingua: eng/Englisch
Libro nella banca dati dal 2007-08-09T02:08:01+02:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-07-29T15:36:34+02:00 (Zurich)
ISBN/EAN: 1441909834
ISBN - Stili di scrittura alternativi:
1-4419-0983-4, 978-1-4419-0983-1
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : cahill, franklin, kim, kuang
Titolo del libro: self packaging, microwave for one, microelectronics
Dati dell'editore
Autore: Ken Kuang; Franklin Kim; Sean S. Cahill
Titolo: RF and Microwave Microelectronics Packaging
Editore: Springer; Springer US
285 Pagine
Anno di pubblicazione: 2009-11-17
New York; NY; US
Stampato / Fatto in
Lingua: Inglese
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XVI, 285 p.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); EA; BC
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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