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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - edizione con copertina flessibile

2007, ISBN: 3836427273

[SR: 3885868], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], 2007-12-17, VDM Verlag Dr. Müller, 189157, Chemie, 121, … Altro …

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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da Amazon.de (Intern. Bücher)
€ 47,99
Spedizione: € 3,001
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Sheng Zhan:

Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - edizione con copertina flessibile

2007, ISBN: 3836427273

[SR: 3885868], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], 2007-12-17, VDM Verlag Dr. Müller, 189157, Chemie, 121, … Altro …

Neuware. Costi di spedizione:Innerhalb EU, Schweiz und Liechtenstein (sofern Lieferung möglich). Versandfertig in 1 - 2 Werktagen. Die angegebenen Versandkosten können von den tatsächlichen Kosten abweichen. (EUR 3.00) DrAlex®
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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - edizione con copertina flessibile

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290… Altro …

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Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - Sheng Zhan
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Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards - edizione con copertina flessibile

ISBN: 3836427273

[SR: 6807651], Taschenbuch, [EAN: 9783836427272], VDM Verlag Dr. Müller, VDM Verlag Dr. Müller, Book, [PU: VDM Verlag Dr. Müller], VDM Verlag Dr. Müller, 557990, Physikalische Chemie, 290… Altro …

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Surface Insulation Resistance Degradation and Electrochemical Migration - Sheng Zhan
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Sheng Zhan:
Surface Insulation Resistance Degradation and Electrochemical Migration - edizione con copertina flessibile

ISBN: 9783836427272

Paperback, [PU: VDM Verlag Dr. Mueller E.K.], This is a Print on Demand title. This book may have occasional imperfections such as missing or blurred pages, poor pictures, errant marks, e… Altro …

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Dettagli del libro
Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards
Autore:
Titolo:
ISBN:

3836427273


Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors and chemical factors. Furthermore, the mechanism of electrochemical migration is not completely understood. In this book, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM.

Informazioni dettagliate del libro - Surface Insulation Resistance Degradation and Electrochemical Migration: The Susceptibility of Lead-free & Eutectic Tin-Lead Solder to Electrochemical Migration on Printed Circuit Boards


EAN (ISBN-13): 9783836427272
ISBN (ISBN-10): 3836427273
Copertina flessibile
Anno di pubblicazione: 2008
Editore: VDM Verlag Dr. Müller
132 Pagine
Peso: 0,263 kg
Lingua: ger/Deutsch

Libro nella banca dati dal 2008-03-15T06:41:49+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2021-12-16T13:59:31+01:00 (Zurich)
ISBN/EAN: 3836427273

ISBN - Stili di scrittura alternativi:
3-8364-2727-3, 978-3-8364-2727-2
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : han
Titolo del libro: resistance, lead and tin, migration

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