Micro And Opto-Electronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set - nuovo libro

EAN (ISBN-13): 9780387279749
ISBN (ISBN-10): 0387279741
Copertina rigida
Copertina flessibile
Anno di pubblicazione: 2007
Editore: Springer
1460 Pagine
Peso: 3,448 kg
Lingua: eng/Englisch

Libro nella banca dati dal 2008-01-22T14:54:32+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-11-19T17:18:52+01:00 (Zurich)
ISBN/EAN: 9780387279749

ISBN - Stili di scrittura alternativi:
0-387-27974-1, 978-0-387-27974-9
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : wong lee, kamphaus, bromet
Titolo del libro: electronic structure materials, micro opto electronic materials structures physics mechanics design reliability packaging volume materials physics materials mechan, materials and structures, suhi

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Dati dell'editore

Autore: Ephraim Suhir
Titolo: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Editore: Springer; Springer US
1460 Pagine
Anno di pubblicazione: 2007-05-29
New York; NY; US
Lingua: Inglese
549,99 € (DE)

SA; BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; Helium-Atom-Streuung; coating; electronics; integrated circuit; interconnect; laser; metal; microelectromechanical system (MEMS); microsystems; optics; optoelectronics; packaging; photonics; production; thin film; Electronics and Microelectronics, Instrumentation; Optical Materials; Engineering Design; Condensed Matter Physics; Spectroscopy; Surfaces, Interfaces and Thin Film; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Konstruktion, Entwurf; Physik der kondensierten Materie (Flüssigkeits- und Festkörperphysik); Spektroskopie, Spektrochemie, Massenspektrometrie; Materialwissenschaft; EA; BC

Materials Physics.- Polymer Materials Characterization, Modeling and Application.- Thermo-Optic Effects in Polymer Bragg Gratings.- Photorefractive Materials and Devices for Passive Components in WDM Systems.- Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability.- Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges.- Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems.- Materials Mechanics.- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension.- Area Array Technology for High Reliability Applications.- Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections.- Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections.- Fatigue Life Assessment for Lead-Free Solder Joints.- Lead-Free Solder Materials: Design For Reliability.- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures.- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods.- Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach.- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension.- Dynamic Physical Reliability in Application to Photonic Materials.- High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction.- The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior.- Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems.- Physical Design.- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- andOpto-Electronic Systems: Role, Attributes, Challenges, Results.- Probabilistic Physical Design of Fiber-Optic Structures.- The Wirebonded Interconnect: A Mainstay for Electronics.- Metallurgical Interconnections for Extreme High and Low Temperature Environments.- Design, Process, and Reliability of Wafer Level Packaging.- Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow.- Reliability and Packaging.- Fundamentals of Reliability and Stress Testing.- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests.- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique.- Interconnect Reliability Considerations in Portable Consumer Electronic Products.- MEMS Packaging and Reliability.- Advances in Optoelectronic Methodology for MOEMS Testing.- Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study.- Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board.- Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics.- Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials.- The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging.- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications.- Adhesive Bonding of Passive Optical Components.- Electrically Conductive Adhesives: A Research Status Review.- Electrically Conductive Adhesives.- Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging.- Die Attach Quality Testing by StructureFunction Evaluation.- Mechanical Behavior of Flip Chip Packages under Thermal Loading.- Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices.