ISBN: 9780792395447
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ISBN: 9780792395447
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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
1994, ISBN: 0792395441
[EAN: 9780792395447], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Altro …
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Costi di spedizione:Versandkostenfrei. (EUR 0.00) Details... |
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
1994, ISBN: 0792395441
[EAN: 9780792395447], Neubuch, [SC: 0.0], [PU: Springer US], INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR; TABLES; COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; CO… Altro …
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Costi di spedizione:Versandkostenfrei. (EUR 0.00) Details... |
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
ISBN: 9780792395447
Hardback, [PU: Springer], This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that wi… Altro …
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ISBN: 9780792395447
[ED: Buch], [PU: Springer US], Neuware - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting… Altro …
David J. Allstot:
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - nuovo libroISBN: 9780792395447
[ED: Buch], [PU: Springer US], Neuware - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting… Altro …
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
1994
ISBN: 0792395441
[EAN: 9780792395447], Neubuch, [SC: 0.0], [PU: Springer US], COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; COMPLEXITY; INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR… Altro …
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
1994, ISBN: 0792395441
[EAN: 9780792395447], Neubuch, [SC: 0.0], [PU: Springer US], INTEGRATEDCIRCUIT; INTERCONNECT; MODEL; MODELING; SEMICONDUCTOR; TABLES; COUNTER; HARDWARE; SIGNAL; WAFER; ANALOG; CIRCUIT; CO… Altro …
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - copertina rigida, flessible
ISBN: 9780792395447
Hardback, [PU: Springer], This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that wi… Altro …
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Informazioni dettagliate del libro - Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
EAN (ISBN-13): 9780792395447
ISBN (ISBN-10): 0792395441
Copertina rigida
Anno di pubblicazione: 1994
Editore: Springer
308 Pagine
Peso: 0,603 kg
Lingua: eng/Englisch
Libro nella banca dati dal 2008-03-17T15:40:48+01:00 (Zurich)
Pagina di dettaglio ultima modifica in 2023-04-11T12:22:05+02:00 (Zurich)
ISBN/EAN: 9780792395447
ISBN - Stili di scrittura alternativi:
0-7923-9544-1, 978-0-7923-9544-7
Stili di scrittura alternativi e concetti di ricerca simili:
Autore del libro : verghese
Titolo del libro: coupling, discrete event system simulation, solutions, integrated circuits
Dati dell'editore
Autore: Nishath K. Verghese; Timothy J. Schmerbeck; David J. Allstot
Titolo: The Springer International Series in Engineering and Computer Science; Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Editore: Springer; Springer US
280 Pagine
Anno di pubblicazione: 1994-12-31
New York; NY; US
Lingua: Inglese
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
Available
XXIII, 280 p.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Schaltkreise und Komponenten (Bauteile); Verstehen; Counter; Hardware; Signal; Wafer; analog; circuit; complexity; integrated circuit; interconnect; model; modeling; semiconductor; simulation; tables; Electronic Circuits and Systems; Electrical and Electronic Engineering; Elektrotechnik; BC
1 Introduction.- 2 Sources of Noise and Methods of Coupling.- 2.1 Semiconductor Device Noise and Phenomena.- 2.2 Noise from Switching Voltage and Current.- 2.3 Inductive Coupling.- 2.4 Capacitive Coupling.- 2.5 Substrate Coupling.- 2.6 Summary.- 3 Semiconductor Device Simulation.- 3.1 Significance.- 3.2 Basic Equations.- 3.3 Boundary Conditions.- 3.4 Models of Physical Parameters.- 3.5 Spatial Discretization.- 3.6 Solution Methods.- 3.7 A Representative Example.- 3.8 Summary.- 4 Simplified Substrate Modeling and Rapid Simulation.- 4.1 Simplified Equation.- 4.2 Spatial Discretization.- 4.3 Boundary Conditions.- 4.4 Solution Methods.- 4.5 Asymptotic Waveform Evaluation (AWE).- 4.6 Substrate AWE Macromodels.- 4.7 Transient Simulation of AWE Macromodels.- 4.8 Substrate DC Macromodels.- 4.9 Matrix Solution.- 4.10 Results.- 4.11 Summary.- 5 Mesh Generation.- 5.1 Adaptive Mesh Refinement.- 5.2 A Priori Mesh Refinement.- 5.3 Summary.- 6 Substrate Modeling in Heavily-Doped Bulk Processes.- 6.1 Motivation.- 6.2 Single Node Substrate Model.- 6.3 Modified Single Node Substrate Model.- 6.4 Summary.- 7 Substrate Resistance Extraction for Large Circuits.- 7.1 Nested Macromodeling.- 7.2 Interpolated Macromodeling.- 7.3 Summary.- 8 Modeling Chip/Package Power Distribution.- 8.1 Effect of Power Bus Structure on Noise coupling.- 8.2 Summary.- 9 Controlling Substrate Coupling in Heavily-Doped Bulk Processes.- 9.1 Characterization of noise coupling concepts.- 9.2 P+ Bulk Wafer Characterization.- 9.3 Effect of Substrate contact placement on coupled noise.- 9.4 Effect of Package Inductance on Substrate noise.- 9.5 Noise Coupling Control Techniques.- 9.6 Summary.- 10 Controlling Substrate Coupling in Bulk P- Wafers.- 10.1 Bulk P- Wafer Characteristics.- 10.2 Substrate Attenuation Structures.-10.3 Summary.- 11 Chip/Package Shielding and Good Circuit Design Practice.- 11.1 Far Field Radiated Emissions.- 11.2 Effect of Chip Signal Isolation/Shielding Techniques on Noise.- 11.3 Effect of Packaging on Noise.- 11.4 Effect of Card Layout and Referencing on Noise.- 11.5 Effect of Circuit Topology on Noise.- 11.6 Summary.- 12 A Design Example.- 12.1 Design of a Mixed-Signal IC.- 12.2 Summary.- Appendices.- A Mesh Moments.- B Convergence Behaviour of Iterative Methods.Altri libri che potrebbero essere simili a questo:
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